Role Responsibilities:

Development of manufacturing test packages and solutions, with particular focus on flying probe (in-circuit testing) for circuit card assemblies.

Creation of flying probe test packages for flying probe (in-circuit testing) of component and net-level defects on circuit card assemblies. Development activities to include:
- Creation of flying probe test programs from circuit card assembly data pack
- Debug of flying probe test package to establish suitable test method and limits
- Creation of manufacturing test documentation, including test specifications, proving reports, and compliance matrices
- Publishing test documentation using company Product-Lifecycle Management tool
Provide technical support on flying probe and in-circuit testing to production test engineers and manufacturing. Support activities to include:
- Assessing production issues with test programs raised via problem reports
- Action change management to test programs using change notices
- Act as point of technical knowledge on in-circuit testing issues that arise in a production environment
Undertake test coverage analysis of circuit card designs to establish a test strategy and make Design-for-Testability recommendations to product design engineers

Skills / Experience / Requirements:

HNC/HND (Electronics) Level of Qualifications or equivalent.
Experience in electronics manufacture and test.
Experience of flying probe test package development, with preference for experience developing on SPEA Flying Probe Test Systems.
A good understand of measurement and test principles, and equipment, with particular emphasis on in-circuit testing.
Good Planning and Organising skills.
Communication skills; the ability to communicate both verbally and in writing.
Analytical and problem solving skills.
Attention to detail.

Guidant Global is acting as an Employment Business in relation to this vacancy.