Role Responsibilities:
Development of manufacturing test packages and solutions, with particular focus on flying probe (in-circuit testing) for circuit card assemblies.
- Creation of flying probe test packages for flying probe (in-circuit testing) of component and net-level defects on circuit card assemblies. Development activities to include:
- Creation of flying probe test programs from circuit card assembly data pack
- Debug of flying probe test package to establish suitable test method and limits
- Creation of manufacturing test documentation, including test specifications, proving reports, and compliance matrices
- Publishing test documentation using company Product-Lifecycle Management tool
- Provide technical support on flying probe and in-circuit testing to production test engineers and manufacturing. Support activities to include:
- Assessing production issues with test programs raised via problem reports
- Action change management to test programs using change notices
- Act as point of technical knowledge on in-circuit testing issues that arise in a production environment
- Undertake test coverage analysis of circuit card designs to establish a test strategy and make Design-for-Testability recommendations to product design engineers
Skills / Experience / Requirements:
- HNC/HND (Electronics) Level of Qualifications or equivalent.
- Experience in electronics manufacture and test.
- Experience of flying probe test package development, with preference for experience developing on SPEA Flying Probe Test Systems.
- A good understand of measurement and test principles, and equipment, with particular emphasis on in-circuit testing.
- Good Planning and Organising skills.
- Communication skills; the ability to communicate both verbally and in writing.
- Analytical and problem solving skills.
- Attention to detail.
Guidant Global is acting as an Employment Business in relation to this vacancy.
